Kulicke & Soffa receives major order for advanced ball bonding
May 02, 2024
Kulicke and Soffa Industries has received a sizeable order from a fast-growing Assembly and Test customer. The order consists of 1,000 RAPID Pro systems, upgraded with the latest ProSuite response-based bonding and looping processes.
ZF and Foxconn completes formation of JV
May 02, 2024
Automotive supplier ZF Friedrichshafen and EMS provider Foxconn, have completed the establishment of their joint venture in the field of passenger car chassis systems.
Topcon to build new manufacturing facility in Germany
April 30, 2024
Topcon Positioning Systems is planning to build a new manufacturing facility in Geisenheim, Germany, near Frankfurt, for the company’s Topcon Electronics operation.
Fraunhofer to expand its collaboration with South Korea
April 30, 2024
Working together to expedite technological innovations in the fields of battery cell and semiconductor technology. That is the aim of an international collaboration program funded by the Korean Ministry of Trade, Industry and Energy (MOTIE).
Guerrilla RF acquires GaN device portfolio from Gallium Semiconductor
April 30, 2024
Guerrilla RF has finalised the acquisition of Gallium Semiconductor's entire portfolio of GaN power amplifiers and front-end modules.
Heilind Electronics formally opens German logistics hub
April 29, 2024
US-based components distributor Heilind Electronics has cut the ribbon on its new facility in Frankfurt-Hanau, which will serve its European customers.
Thin-film electronics can be 'fabbed', say researchers
April 29, 2024
New research by KU Leuven and imec concludes that the foundry production model can be applied to the field of flexible thin-film electronics.
Mobis starts construction of new EV battery plant in Spain
April 25, 2024
Auto parts maker Hyundai Mobis is starting the construction of a new plant in Spain. The new electric vehicle battery system plant will serve as a dedicated facility supplying Volkswagen.
Toradex acquires Linear Computing
April 25, 2024
Embedded systems specialist Toradex announces that it has acquired Linear Computing Inc. (LCI).
ZF opens automotive technology center in Mexico.
April 23, 2024
Mobility technology company ZF has officially opened the campus that will house four corporate function hubs for North America and the company's first R&D center in Monterrey, Mexico.
Rohde & Schwarz opens new facility in India
April 23, 2024
On April 22, Rohde & Schwarz inaugurated a new facility centre in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services.
Festo and Phoenix Contact enter technology partnership
April 23, 2024
Festo, manufacturer of pneumatic and electrical automation technology, will use PLCnext Technology, the open ecosystem for automation from Phoenix Contact, in future intelligent devices.
Infosys to acquire German automotive engineering firm
April 22, 2024
India's Infosys has reached an agreement to purchase in-tech, a provider of engineering R&D services to the automotive, rail and smart industry sectors.
Axcelis ships multiple systems to SiC chipmakers
April 18, 2024
Axcelis Technologies announces multiple shipments of the Purion Power Series ion implanter systems to silicon carbide (SiC) power device chipmakers worldwide.
IT breach at Nexperia
April 16, 2024
Nexperia says that it has become aware that an unauthorised third party accessed certain of its IT servers in March 2024.
Qualcomm drops bid to buy Autotalks
April 16, 2024
Qualcomm has terminated its deal to acquire Israeli V2X communications company Autotalks.
Microchip acquires Neuronix AI Labs
April 16, 2024
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
SweGaN confirms strategic partnership with RFHIC
April 15, 2024
Swedish semiconductor manufacturer SweGaN has announced a strategic equity investment and joint product development deal with Korea's RFHIC Corporation.
Huawei to develop lithography tech at new R&D centre
April 12, 2024
Chinese tech giant Huawei is reported to be building a new research unit in Shanghai. It wants to develop chipmaking tools that could eventually rival those of ASML, Canon, and Nikon.
Microchip acquires VSI
April 11, 2024
Microchip Technology has completed the acquisition of Seoul, Korea-based VSI Co. Ltd., a specialist in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for In-Vehicle Networking (IVN).
CSA Catapult opens new advanced packaging facility
April 11, 2024
A new GBP 1.6 million facility to help accelerate electrification across the UK has officially opened at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales.
TT Electronics awarded contract with Kongsberg
April 11, 2024
TT Electronics' Fairford UK business has been awarded a new contract with Kongsberg Defence and Aerospace for the production of complex cable harness solutions.
Canada commits CAD 2.4bn to grow its AI sector
April 09, 2024
The federal government of Canada has agreed a financial package to boost the country's AI activity. It includes a new AI Compute Access Fund.
SolarEdge acquires EV charging startup Wevo Energy
April 05, 2024
Publicly listed US firm SolarEdge has bought the entire share capital of Wevo Energy to boost its presence in the commercial and industrial (C&I) segment.
Earthquake update: Taiwan's tech sector weathers the storm
April 04, 2024
Taiwan's wafer foundries and DRAM production remains unaffected following the earthquake that struck the island on April 3, 2024.
Its official: SK hynix to invest $3.87 billion in US plant
April 04, 2024
South Korean memory specialist SK hynix says that it will invest an estimated USD 3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Hensoldt completes its acquisition of ESG
April 04, 2024
Sensor solutions provider Hensoldt has completed the acquisition of ESG Elektroniksystem- und Logistik-GmbH – which was agreed upon last year – with effect from 2 April 2024.
Intel foundry unit sees increased losses, turning the ship around
April 03, 2024
Intel Corporation has outlined a new financial reporting structure, aligned with the company’s previously announced foundry operating model for 2024 and beyond.
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